Minnesota NADCAP Certified Plating Services
Nadcap Criteria for Chemical Processing - AC7108 Rev D
Gold, Silver, Copper, Electrolytic Nickel, Hi-Phos Electroless Nickel,
Mid-Phos Electroless Nickel, Tin, Cadmium, Chemical Film,
Anodizing, Passivation
Kansas NADCAP Certified Plating Services
Nadcap Criteria for Chemical Processing - AC7108 Rev D
Hi-Phos Electroless Nickel, Mid-Phos Electroless Nickel, Chemical Film,
Anodizing, Passivation
We Are ISO 9001:2000 AS9100 B Registered and BAE Systems (United Defense) Approved
Plating Processes
Copper per Mil-C-14550, AMS 2418
Electroless Nickel per Mil-C-26074, AMS-C-26074, AMS 2404,
580-5296-001, MPS 175
High Phos. Electroless Nickel per ASTM B733, RO56A201, 952-0766-001,
580-0766-001, PTF (Teflon Nickel) per 5982305
Electro. Nickel (Bright & Matte) per QQ-N-290, AMS-QQ-N-290, AMS 2403
ASTM B 689, 580-0070 & MPS 174
Gold per Mil-G-45204, AMS B 488-01, AMS 2422D, MIL DTL 45204 & 580-0143-00
Silver per QQ-S-365, ASTM B700 & AMS2412
(Matte, Sulfur Free Semi-Bright, Bright)
Tin (Matte & Bright) per Mil-T-10727, ASTM B 454 (Acid & Cyanide)
Immersion Tin for Printed Circuit Boards
Tin Lead (Bright 90 / 10 & 60 / 40) per Mil-P-81728, 580-0482 & 580-0825
Alkaline Bismuth Tin per Mil-T-10727, ASTM B 574, 580-0151 & 580-0225
Cad. per QQ-P-416F, Mil S 5002, 580-0050, 580-0530, AMS-QQ-P-416 & AMS 2400 (Clear,Yellow, Olive Drab Chromate)
Conversion & Other Processes
Electropolish-Stainless Steel, Aluminum, Copper Alloys
Chem. Film / Irridite per Mil-C-5541E, Mil-DTL-5541, AMS 2473,
580-0036Class IA & III
Anodize per Mil-A-8625F, AMS A-8625, AMS 2472 & 580-0008 Type II & III
(Clear, Black, Yellow, Gray, Blue, Red, Green, Blue / Gray, Purple)
Teflon Impregnated Anodize, Bright Anodize
Passivation on Stainless Steel QQ-P-35, AMS QQ P 35, Mil S 5002, C5041,
580-0025, ASTM A967& AMS 2700
Passivation Titanium
Black Oxide on Copper Alloys per Mil-F-495E
Heat Treat of Beryllium Copper
Chemical Film for Copper and Copper Alloys 580-0034-000
Mechanical Finishing
Tumbling, Sand Blasting,
Laser Etching
Some of the services include precious and non-precious metal plating on precision component parts. Using the latest technology and special handling equipment for extremely small and / or delicate parts, we provide immersion tin, immersion gold, and deep gold services to the printed circuit board industry.
Industries Served
| • Aerospace | • Telecommunications |
| • Medical | • Defense |
| • Electronics | • Computer |
| • Special Equipment Customers |
Capabilities
| • Advanced Plating Processes | • Engineering Assistance |
| • Fully Equipped Lab | • Custom Masking & Racking |
| • Stock to Dock | • Part Marking |
| • Custom Packaging & Shipping | • Laser Etching |
Testing Capabilities
Conductivity, Salt Spray, Porosity, Humidity, Solderability,
Bend & Scrape, Surface Roughness
NEW! NEW! NEW!
We now have the latest in analytical testing equipment.
Our newly acquired PerkinElmer Inductively Coupled Plasma instrument provides automatic analysis and documentation of all plating baths and waste streams. This equipment adds real time responsiveness to our traditional atomic absorption capability.
Additional Testing Equipment
